Vogel Optoelectronics’ revenue increased by 86% in the first half of the year, with vehicle product sales revenue reaching 71.6 million yuan.

On the evening of August 16, Vogel Optoelectronics released its 2022 semi-annual report. The company's operating income during the reporting period was 745 million yuan, a year-on-year increase of 85.51%; the net profit attributable to shareholders of listed companies was -4.9455 million yuan, which turned from profit to loss year-on-year; the net profit attributable to shareholders of listed companies after deducting non-recurring gains and losses was -8.2379 million yuan, which turned from profit to loss year-on-year.
Wogel Optoelectronics said that during the reporting period, against the background of geopolitical turmoil, high inflation, currency fluctuations and supply chain disruptions, consumer electronics product shipments continued to decline, and the unit sales price also declined to a certain extent.
During the reporting period, the company mainly focused on the production capacity layout of "glass-based" new materials in the fields of consumer electronics, vehicle display and semiconductor packaging. In terms of automotive displays, Mini LED backlights have great application advantages due to their high brightness, long life, and low cost. In terms of Mini displays, glass-based ones have more advantages than PCB-based ones in terms of flatness, thinness, and large screen size.

During the reporting period, Woge Optoelectronics has completed the integration of the backlight and display module industry chain, forming a highly collaborative vertically integrated industrial layout, including high-endProduct mass production and processing capabilities for business modules such as appearance parts, touch modules, LCM modules and backlight modules. In order to effectively integrate the superior resources within the company group and give full play to the R&D and customer synergies of automotive display products, during the reporting period, the company integrated the products of various business departments and established the automotive division. At the same time, the glass cover products of the third division were integrated into the automotive division, focusing on promoting the commercialization of Mini LED glass-based backlights and 3A glass integrated black covers in automotive display modules to create a second growth curve.

During the reporting period, the company achieved sales revenue of 71.6 million yuan in vehicle products. Up to now, the company's subsidiary Shenzhen Huichen has signed a strategic cooperation agreement with the industry's leading automotive display company and has begun mass supply; its subsidiary Dongguan Xingwei has 18 automotive pre-installation market customers such as Foxconn, Yuanfeng and Skyworth, and project partners include 18 terminal car companies including SAIC-GM, Dongfeng Honda, GAC Mitsubishi, Great Wall, Changan, FAW Jiefang, Geely, Chery, JAC, Aian, Nezha, Volkswagen Sihao and other terminal car companies.

In the field of semiconductor packaging, Vogel Optoelectronics has also made major breakthroughs. The company has industry-leading glass thinning, TGV (through glass via), sputtered copper and microcircuit patterning technologies. It has the ability to produce a large number of micron-level through holes in glass, with a minimum aperture of 10μm and a thickness of 0.15-0.2mm to achieve lightness and thinness. It is one of the few manufacturers in the world that has mastered TGV technology. Through its R&D layout in the field of chip board-level packaging carrier boards, the company has overcome the technical difficulties of packaging carrier boards. Currently, some products have passed customer verification and are expected to be produced in small batches in the second half of this year.

During the reporting period, the company and Hubei Tianmen High-tech Investment jointly established a joint venture, Hubei Tongge Micro. The products are mainly glass-based IC carrier boards. The current application areas mainly include MIP packaging and semiconductor packaging and testing (2.5D/3D packaging). MIP packaging is to transfer a large amount of Micro LED chips to the substrate (glass or BT) for secondary packaging; then the secondary packaging package is solidified onto the drive carrier board. Up to now, the construction of Hubei Tongge Micro Company and its chip board-level packaging carrier board project is progressing smoothly, and it is expected to have the ability to ship in batches in the second half of next year.

Woge Optoelectronics said that the company also signed a strategic cooperation agreement with Zhongqi Optoelectronics.It is discussed that it is mainly used for Micro LED MIP packaging to improve stability and repair yield. At the same time, the company has worked with other downstream companies in the supply chain to carry out the preliminary product sample verification stage of glass-based IC packaging carrier boards. In the future, the company will focus on promoting the application of chip board-level packaging carrier boards in MIP packaging, 2.5D/3D packaging, radio frequency chip carrier boards, optical communication chip carrier boards and other chip carrier boards. It is expected that these products have broad development prospects.